thermal bonding

A Silicon Wafer Direct Bonding Mechanism and Rapid Thermal Bonding Technology

硅片直接键合机理及快速热键合工艺

Study on Thermal Bonding of PMMA

PMMA面键合的热压法工艺研究

Investigation on the test method of rupture forces of thermal bonding seams in nonwovens shopping bags

非织造布购物袋热黏合接缝强力的测试方法探讨

A composite YAG/ Nd: YAG crystal was obtained by using the thermal bonding technique under a specific temperature and pressure.

本文在一定的温度和压力下，通过热键合技术，获得了YAG/Nd：YAG复合晶体。

This paper deals with the influences of the processing parameters ( canlender temperature, nip pressure, calender speed and pattern) on the properties of thermal bonding nonwoven fabrics.

本文分析探讨了热粘合加工工艺参数（轧辊温度、压力、速度和轧辊花纹）对热粘合非织造布性能的影响。

The method of preparing the uniform coating, the techniques of thermal bonding and hydrogen plasma treatment was investigated experimentally. The optimum coating method and technological parameters was summarized.

重点探索了涂覆金刚石纳米涂层的方法、实现金刚石与金属钛的热粘接工艺以及氢等离子体处理的工艺参数，筛选出了在本实验系统中的最佳方法和工艺条件。

Discussion about Thermal Bonding Technologies of Light-weight PET Nonwovens

薄型聚酯非织造布热轧工艺的探讨

Fracture of integrated metal microelectrodes likely happens during the thermal bonding process of polymer microfluidic chips. To solve this fracture problem, an electrifying-electrodes assisted thermal bonding method is put forward.

集成金属薄膜微电极在聚合物微流控芯片热键合过程中容易产生断裂，为此提出了一种电极通电辅助热键合方法。

In thermal bonding process, surface affinity treatment, vacuum pro-bonding and bonding temperature control were studied experimentally without clean room condition.

在高温键合工艺试验中针对表面亲和处理、抽真空预键合以及键合温度时序控制等方面进行研究，重点讨论了非超净环境下高效预键合方法。

Films for lamination were prepared via a melt blending of thermoplastic polyurethane ( TPU) and polyester with low melt point, and their moisture permeability, thermal bonding properties, resistance to hydrostatic pressure and mechanical properties were tested.

用低熔点聚酯对热塑性聚氨酯进行改性，并对所制备的复合薄膜进行热粘合强度、DSC、透湿性、耐静水压以及力学等各项性能测试。

The experimental result shows that this method can increase the effective bonding area, improve the bonding quality of the microfluidic chip compared to the conventional thermal bonding method. The bonding rate of the chips has been improved significantly at the optimal water pretreatment time.

实验结果表明：与常规的热压键合方法相比，该方法可有效增加芯片键合有效面积，在最佳水预处理时间下，芯片键合率明显提高。

Thermal bonding technology for PMMA based micro flow through PCR chip

激光制备PMMA基PCR微流控芯片的热压键合研究

The latest development of planar waveguide lasers is summarized, including thermal bonding technique, new idea of double-clad pumping planar waveguide and passively Q-switched double-clad waveguide laser.

介绍了热键合双包层平板波导激光器的研究进展，包括热键合技术的优越性，双包层平板波导的新思想，集成可饱和吸收体的被动调Q波导激光器。

A Study of Processing Parameters and Performances Simulation Testing of Thermal Bonding Nonwoven Fabrics

热粘合非织造布的工艺参数及其性能模拟测试

Accompanied with the development of thermal bonding technology, composite crystal become an effective method to reduce thermal effect.

随热键合技术的日益成熟，键合晶体己成为减缓激光器热效应的有效手段之一。

The analysis of linear thermal expansion and bonding act of magnetic electron of nickel

镍的线热膨胀分析和磁性电子的键合作用

Electrifying-electrodes Assisted Thermal Bonding Method and Fabrication of Multi-metal Microelectrodes Integrated on the Single Substrate THE APPLICATION OF THE BILATERAL AXIAL POLE-DIPOLE IP SOUNDING TO THE EXPLORATION OF LEAD-ZINC POLYMETALLIC DEPOSITS

电极通电辅助热键合与多种金属微电极的单片集成双侧轴向单极&偶极激电测深在勘查铅锌等多金属矿中的应用

Impact of the chip bonding layer material on the thermal resistance of power LED

芯片键合层材料对功率型LED热阻的影响

The electrode is electrified during the thermal bonding process, which heats the electrode quickly. The heating process improves the ductibility of the electrode, which obviates the fracture of the electrode.

在热键合过程中，对金属微电极进行通电，使其温度迅速升高，以提高其自身延展性，进而避免电极产生断裂。

The sources of stresses caused by thermal bonding of GaAs/ GaAlAs photocathode to glass and the influences of the crystal stresses on width and intensity of X-ray double crystal diffraction peak are analyzed.

分析了GaAs／GaAlAs阴极粘结工艺中应力产生的根源和晶体中应力对X射线双晶衍射峰的宽度和强度的影响。

The thermal bonding process minimizes media migration, providing consistent and reliable performance.

热粘合过程中尽量减少滤芯的迁移, 提供一致的和可靠的性能.

Ultrasonic plastic welding ( UPW) is a cost-effective, efficient and clean fusion bonding technique of TPC ( Thermal Plastic Composites), and of great value in application.

超声波塑料焊接是一种经济、高效、环保的热塑性塑料连接新工艺，有极大的推广应用前景。

Thermal Stability and Bonding Strength of Hydroxyapatite/ zirconia Composite Coatings

羟基磷灰石/氧化锆复合涂层热稳定性和结合强度的研究

Thermal bonding and its application in laser system

热键合技术及其在激光方面的应用

Using the hot embossing machine as the thermal bonding device, effects of the bonding temperature, pressure and time on the deformation of microchannel dimensions are systematically studied using the orthogonal factorial design.

使用热压机作为热键合设备，采用正交试验设计方法，系统地研究了键合温度、压强和时间对于热键合过程中微沟道变形的影响；

The proper use of hollow fibers, fine-denier fibers and thermal bonding fibers can make battings have the characteristics of light mass, warmth retention and lasting compression elasticity.

采用中空纤维、细旦涤纶和粘结纤维适当搭配的方式，可以使絮片兼具轻质、保暖和持久压缩弹性。

The fabrications of glass microfluidic chips by using photolithograph, wet etching and thermal bonding methods and PMMA microfluidic chip by hot embossing and direct bonding methods were studied.

采用热压和键合的方法制作玻璃和有机聚合物（PMMA）芯片，对玻璃和PMMA芯片在高压直流电场作用下的伏安特性进行了研究和分析。

Research on silicon-glass thermal bonding with SiO_2 film assist

SiO2薄膜辅助硅-玻璃热键合技术的研究

The bonding methods used in micro assembly includes adhesive bonding, thermal bonding, solvent bonding, laser bonding, etc, which have limits in some respects.

目前应用于聚合物微装配的联接方法主要有胶粘接、热键合、溶剂键合、激光键合等，以上方法均在某些方面存在着各自的局限性。

It is suggested that the linear thermal expansion coefficient plays an important role in bonding process through contrast test of anodic bonding between K4 glass and aluminum.

通过K4玻璃与铝片焊接的对比试验，说明材料的线膨胀系数对焊接过程产生了极大的影响。